All tape and film processing and lamination are performed in a cleanroom. For fine processing that cannot be achieved with molds, we have made cost-effective mass production possible by combining laser processing with die-cutting techniques.
Even thin films which are difficult to handle, such as those used for sensing, can be precisely micro-processed without burrs using UV laser technology. We also support accurate, continuous, and cost-effective processing of printed products such as RFID. In addition, high-precision lamination of tapes and films can be achieved using jigs, and we can process difficult materials such as OCA tapes and hard-coat films used around display components.
Precision die-cutting of tapes and films / Microfabrication using UV lasers / Lamination of tape and film materials / Removal of air bubbles during lamination by pressure degassing / Hydrophilic surface treatment using sprayer / Packaging by tray packing
