CSTEC’s laser processing is characterized by its ability to achieve high-precision processing with minimal burrs compared to de-cutting or CO2laser processing. Therefore, it is suitable for components requiring high precision, such as automotive parts, and making it widely used in medical and research products which fine processing is required. Laser processing is an ideal method for quick prototyping and small-lot production.
We can use five wavelengths: fundamental wave (1064 nm), green laser (532 nm), UV laser (355 nm), deep UV laser (266 nm), and CO2 laser. This enables high-precision laser microfabrication. CO2 lasers can process product with its sizes up to 1 m x 2 m,
then we can handle large products that were previously difficult to process.
We have a unique super cleanroom facility (ISO Classs 1) in the world. In an extremely clean environment where there are fewer than 10 particles of 0.1 microns per cubic meter, we can perform processing, assembly, and lamination. This is highly appreciated by our customers in the medical and scientific fields.
With UV laser specific heat processing, we can process holes of several tens of microns without burrs.
In addition, by using our equipment powered by four UV wavelength lasers plus a high power large CO2 laser, we can process every kind of materials. Furthermore, by combining this process with our die-cutting process, available processing is further expanded..
（ About precision die-cutting）
We have solved many customers’ problems through our laser microfabrication and contract processing. We have various case studies of processing such as sensor films, microchannel chips, substrates, and die-cutting on adhesive films.
Details are available on our website focusing on laser processing. Find it today!
